The low density of PHENOSET® microspheres helps to
reduce the weight of the finished product.
PHENOSET® microspheres have excellent compatibility with
resins. When used in syntactic foams, PHENOSET®
microspheres make it easy to machine with clean and precise edge cuts.
compatability with resins.
PHENOSET® microspheres can form excellent chemical bonds
with organic base resins such as epoxy, polyester, polyurethane and
others to produce a composite with very good physical properties. No
coupling agents are required to achieve bonding of the PHENOSET®
microspheres and resin matrix.
The inherent bonding of the spheres with the
base resin prevents the filler from scarring or popping from the
surface of the composite. Hence, PHENOSET® microspheres
can contribute to the outstanding smoothness of composites.
- Strength to
although lightweight, have comparatively high mechanical strength.
PHENOSET® microspheres, being spherical, roll
easily over one another. This helps improve the flowability of the
matrix to which they are added.
- Low Viscosity
for High Loading.
The spherical shape of PHENOSET®
microspheres gives lower resin viscosity when compared to equivalent
loading of other irregular-shaped fillers.
- Good FST
PHENOSET® microspheres can char without
emission of toxic fumes and with low emission of smoke. Used in
aerospace applications, the PHENOSET® microspheres can
contribute good FST properties as required.
being phenolic and hollow in nature, acts as a sacrificial media to
protect and insulate structures subjected to extreme thermal
environment. They absorb heat, burn off without smoke and remove heat
from the structure.